Peter Podesser
Chief Executive Officer bij SFC ENERGY AG
Vermogen: 3 M $ op 31-03-2024
Profiel
Peter Podesser is currently the Chief Executive Officer at SFC Energy AG since 2006.
Prior to this, he was the President & Chief Executive Officer at EV Group GmbH from 2000 to 2005.
He also served as President at Oerlikon USA, Inc. (Florida).
Dr. Podesser holds an MBA and a doctorate from Vienna University of Economics & Business.
Bekende belangen in openbare bedrijven
Onderneming | Datum | Aantal aandelen | Totale waarde | Waarderingsdatum |
---|---|---|---|---|
SFC ENERGY AG
0.77% | 31-12-2023 | 133 700 ( 0.77% ) | 3 M $ | 31-03-2024 |
Actieve functies van Peter Podesser
Bedrijven | Functie | Begin |
---|---|---|
SFC ENERGY AG | Chief Executive Officer | 01-11-2006 |
Eerdere bekende functies van Peter Podesser
Bedrijven | Functie | Einde |
---|---|---|
EV Group GmbH
EV Group GmbH SemiconductorsElectronic Technology EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions. Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. | Chief Executive Officer | 01-01-2005 |
Oerlikon USA, Inc. (Florida)
Oerlikon USA, Inc. (Florida) Industrial MachineryProducer Manufacturing Part of OC Oerlikon Corp. AG, Oerlikon USA, Inc. is a private company based in St. Petersburg, FL that develops and markets semiconductor manufacturing machinery and technologies. | President | - |
Opleiding van Peter Podesser
Vienna University of Economics & Business | Doctorate Degree |
Ervaring
Beklede functies
Actief
Inactief
Beursgenoteerde bedrijven
Bedrijven in privébezit
Connecties
Eerstegraads connecties
Bedrijven verbonden in de eerste graad
Man
Vrouw
Besturend
Uitvoerend
Verwante bedrijven
Beursgenoteerde bedrijven | 1 |
---|---|
SFC ENERGY AG | Electronic Technology |
Bedrijven in privébezit | 2 |
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Oerlikon USA, Inc. (Florida)
Oerlikon USA, Inc. (Florida) Industrial MachineryProducer Manufacturing Part of OC Oerlikon Corp. AG, Oerlikon USA, Inc. is a private company based in St. Petersburg, FL that develops and markets semiconductor manufacturing machinery and technologies. | Producer Manufacturing |
EV Group GmbH
EV Group GmbH SemiconductorsElectronic Technology EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions. Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. | Electronic Technology |