![Osamu Okada](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Momenteel actieve connecties
Naam | Geslacht | Leeftijd | Verwante bedrijven | Samenwerking |
---|---|---|---|---|
Toshiyuki Yamagishi | M | 63 |
Casio Micronics Co., Ltd.
![]() Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry. | - |
Takeshi Wakabayashi | M | - |
Casio Micronics Co., Ltd.
![]() Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry. | - |
Takashi Shiraishi | M | - |
Casio Micronics Co., Ltd.
![]() Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry. | - |
Yoshinori Tazoe | M | - |
Casio Micronics Co., Ltd.
![]() Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry. | - |
Relatiegrafiek
Connectie in verschillende bedrijven
Statistieken
Land | Connecties | % van het totaal |
---|---|---|
Japan | 4 | 100.00% |
Ouderdom van de connecties
Actief
Verleden
Man
Vrouw
Besturend
Uitvoerend
Oorsprong van de connecties
- Beurs
- Insiders
- Osamu Okada
- Persoonlijk netwerk