Toshiyuki Yamagishi
Director/Board Member bij CASIO COMPUTER CO., LTD.
Profiel
Toshiyuki Yamagishi currently works at Casio Computer Co., Ltd., as Director, Executive Officer & Head-ESG Strategy from 2020 and Casio Micronics Co., Ltd., as Executive Officer & Senior Manager-Business from 2012.
Actieve functies van Toshiyuki Yamagishi
| Bedrijven | Functie | Begin |
|---|---|---|
| CASIO COMPUTER CO., LTD. | Director/Board Member | 01-06-2013 |
Casio Micronics Co., Ltd.
 Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry. | Corporate Officer/Principal | 26-03-2012 |
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Verwante bedrijven
| Beursgenoteerde bedrijven | 1 |
|---|---|
| CASIO COMPUTER CO., LTD. | Consumer Durables |
| Bedrijven in privébezit | 1 |
|---|---|
Casio Micronics Co., Ltd.
Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry. | Electronic Technology |
