Hisao Nishimura

Part of Towa Corp., Bandick Corp. is a Japanese semiconductor packaging solution company focused on meeting customer needs. The company specializes in a transfa system that uses fluid resin to protect semiconductor chips and sell molding devices using compression methods. The company's goal is to create a new future in the field of semiconductor packaging with a quarter lead and the world's most advanced technology. The company also offers a cbn end mill product with high accuracy, wear resistance, and long life.

The Bank of Kyoto, Ltd. engages in the provision of financial services. It operates through the Banking Business and Others segments. The Banking Business segment includes deposits and loans services, trading securities, securities investment, and domestic and foreign exchange services. The Others segment includes credit guarantee, lease, and credit card businesses. The company was founded on October 1, 1941 and is headquartered in Kyoto, Japan.