Hisao Nishimura

Part of Towa Corp., Bandick Corp. is a Japanese semiconductor packaging solution company focused on meeting customer needs. The company specializes in a transfa system that uses fluid resin to protect semiconductor chips and sell molding devices using compression methods. The company's goal is to create a new future in the field of semiconductor packaging with a quarter lead and the world's most advanced technology. The company also offers a cbn end mill product with high accuracy, wear resistance, and long life.