Loopbaan van G. William Knapp
Eerdere bekende functies van G. William Knapp
| Bedrijven | Functie | Begin | Einde |
|---|---|---|---|
Invensas Bonding Technologies, Inc.
 Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | Corporate Officer/Principal | - | - |
Opleiding van G. William Knapp
| North Carolina State University | Graduate Degree |
| University of Cincinnati (Ohio) | Undergraduate Degree |
Statistieken
Internationaal
| Verenigde Staten | 4 |
Operationeel
| Corporate Officer/Principal | 1 |
| Graduate Degree | 1 |
| Undergraduate Degree | 1 |
Sectoraal
| Consumer Services | 3 |
| Electronic Technology | 2 |
Beklede functies
Actief
Inactief
Beursgenoteerde bedrijven
Bedrijven in privébezit
Verwante bedrijven
| Bedrijven in privébezit | 1 |
|---|---|
Invensas Bonding Technologies, Inc.
Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | Electronic Technology |
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