Bao Zeng Wang
Directeur/Bestuurslid bij Henghui Technology Corp. Ltd.
Actieve functies van Bao Zeng Wang
| Bedrijven | Functie | Begin | Einde |
|---|---|---|---|
Henghui Technology Corp. Ltd.
 Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Directeur/Bestuurslid | 01-11-2020 | - |
Loopbaan van Bao Zeng Wang
Opleiding van Bao Zeng Wang
| Southeast University | Graduate Degree |
Statistieken
Internationaal
| China | 3 |
Operationeel
| Director/Board Member | 1 |
| Graduate Degree | 1 |
Sectoraal
| Producer Manufacturing | 2 |
| Consumer Services | 2 |
Beklede functies
Actief
Inactief
Beursgenoteerde bedrijven
Bedrijven in privébezit
Verwante bedrijven
| Bedrijven in privébezit | 1 |
|---|---|
Henghui Technology Corp. Ltd.
Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Producer Manufacturing |
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