![William Crockett](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
William Crockett
Corporate Officer/Principal bij Microbonds, Inc.
Profiel
William Crockett is currently working as the Vice President-Business Development at Microbonds, Inc. since 2005.
He previously worked as a Principal at Statschippac Ltd.
and the US Department of the Navy (District of Columbia).
He completed his undergraduate degree at California Polytechnic State University (San Luis Obispo).
Actieve functies van William Crockett
Bedrijven | Functie | Begin |
---|---|---|
Microbonds, Inc.
![]() Microbonds, Inc. SemiconductorsElectronic Technology Microbonds, Inc. develops microchip interconnect solutions. It engages in the research and development and application of gold and copper insulated bonding wire technology for the semiconductor packaging and microchip industries. The company was founded by John I. Persic and Robert Lyn in 1999 and is headquartered in Markham, Canada. | Corporate Officer/Principal | 01-01-2005 |
Eerdere bekende functies van William Crockett
Bedrijven | Functie | Einde |
---|---|---|
Statschippac Ltd.
![]() Statschippac Ltd. SemiconductorsElectronic Technology Statschippac Ltd. provides semiconductor packaging design, assembly, testing, and distribution solutions. The private company is based in Fremont, CA. | Corporate Officer/Principal | - |
US Department of the Navy (District of Columbia) | Corporate Officer/Principal | - |
Opleiding van William Crockett
California Polytechnic State University (San Luis Obispo) | Undergraduate Degree |
Ervaring
Beklede functies
Actief
Inactief
Beursgenoteerde bedrijven
Bedrijven in privébezit
Connecties
Eerstegraads connecties
Bedrijven verbonden in de eerste graad
Man
Vrouw
Besturend
Uitvoerend
Verwante bedrijven
Bedrijven in privébezit | 3 |
---|---|
Microbonds, Inc.
![]() Microbonds, Inc. SemiconductorsElectronic Technology Microbonds, Inc. develops microchip interconnect solutions. It engages in the research and development and application of gold and copper insulated bonding wire technology for the semiconductor packaging and microchip industries. The company was founded by John I. Persic and Robert Lyn in 1999 and is headquartered in Markham, Canada. | Electronic Technology |
US Department of the Navy (District of Columbia) | Government |
Statschippac Ltd.
![]() Statschippac Ltd. SemiconductorsElectronic Technology Statschippac Ltd. provides semiconductor packaging design, assembly, testing, and distribution solutions. The private company is based in Fremont, CA. | Electronic Technology |