Jian Jun Chen
Corporate Officer/Principal bij Huatian Technology (Kunshan) Electronics Co. Ltd.
Oorsprong van het eerstegraads netwerk van Jian Jun Chen
| Entiteit | Type entiteit | Industrie | |
|---|---|---|---|
Huatian Technology (Kunshan) Electronics Co. Ltd.
 Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China.
9
| Holding Company | Electronic Production Equipment | 9 |
Grafiek van bedrijven verbonden in de tweede graad
Connectie in verschillende bedrijven
Bedrijven verbonden met Jian Jun Chen via zijn persoonlijke netwerk
| Onderneming | Sector | Gelieerde personen | Hoofdpost |
|---|---|---|---|
| TIANSHUI HUATIAN TECHNOLOGY CO., LTD. | Semiconductors | Chairman Corporate Secretary Director of Finance/CFO Director/Board Member | |
Tianshui Huatian Electronics Group Co., Ltd.
 Tianshui Huatian Electronics Group Co., Ltd. Electronic ComponentsElectronic Technology Tianshui Huatian Electronics Group Co. Ltd. develops and distributes electronic instruments. Its products include To220, TO220F, TO-263, DPAK, IPAK, TO-3P and TO-247. The company was founded in 1969 and is headquartered in Tianshui, China. | Electronic Components | Chairman Director/Board Member | |
Xian Tiansheng Electronics Co. Ltd.
 Xian Tiansheng Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Part of Tianshui Huatian Technology Co., Ltd., Xian Tiansheng Electronics Co. Ltd. is a Chinese company that develops and distributes printed circuit assemblies. The company is based in Xi'an, China. Xian Tiansheng Electronics Co. was acquired by Tianshui Huatian Technology Co., Ltd. from Tianshui Huatian Electronics Group Co., Ltd. on June 21, 2008 for $6.80 million. | Electronic Production Equipment | Chairman Director/Board Member | |
| Tianshui Huatian IC Packaging Material Co. Ltd. | Chairman Director/Board Member | ||
| Tianshui Huatian Machinery Co. Ltd. | Chairman Director/Board Member | ||
Xiamen Yonghong Group Co. Ltd.
 Xiamen Yonghong Group Co. Ltd. SemiconductorsElectronic Technology Xiamen Yonghong Group Co., Ltd. manufactures and distributes semi conductor lead frames. It also provides precise tooling products. The company distributes products to United States and other European countries. Xiamen Yonghong Group is located in Xiamen, China | Semiconductors | Director/Board Member Corporate Officer/Principal | |
Huatian Technology (Xi'an) Co Ltd
 Huatian Technology (Xi'an) Co Ltd SemiconductorsElectronic Technology Part of Tianshui Huatian Technology Co., Ltd., Huatian Technology (Xi'an) Co Ltd is a Chinese company that manufactures and sells semiconductor integrated circuits and semiconductor components. The company is based in Xi'an, China. The company was founded in 2008. The CEO is Jian Jun Liu. | Semiconductors | Chairman Director/Board Member | |
| Tianshui Huatian Sensor Co. Ltd. | Chairman | ||
| Tianshui 749 Electronics Co. Ltd. | Chairman | ||
| UNISEM (M) | Semiconductors | Director/Board Member | |
| Fudan University | College/University | Doctorate Degree | |
| Adelphi University | College/University | Masters Business Admin | |
Unisem Advanced Technologies Sdn. Bhd.
 Unisem Advanced Technologies Sdn. Bhd. SemiconductorsElectronic Technology Unisem Advanced Technologies Sdn. Bhd. manufactures electron tubes and semiconductors. Its services include gold bumping, electroplated solder bumping, electroplated copper pillar bumping, large solder bumping, PBO, polyimides & BCB passivation, redistribution of bond pads and in-house photo mask and stencil design capability. The company was founded on September 13, 2004 and is headquartered in Perak, Malaysia. | Semiconductors | Director/Board Member | |
FlipChip International LLC
 FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Semiconductors | Director/Board Member |
Statistieken
Internationaal
| China | 11 |
| Maleisië | 3 |
| Verenigde Staten | 3 |
Sectoraal
| Electronic Technology | 9 |
| Consumer Services | 3 |
Operationeel
| Director/Board Member | 12 |
| Chairman | 9 |
| Corporate Officer/Principal | 3 |
| Director of Finance/CFO | 2 |
| Corporate Secretary | 1 |
Sterkste connecties
| Insiders | |
|---|---|
| Sheng Li Xiao | 10 |
| Zhi Yi Xiao | 8 |
| Wen Ying Chang | 6 |
| Yong Song | 3 |
| Guang Zhi Li | 1 |
| Sam Hu | 1 |
| Martin Wang | 1 |
| Andy Ding | 1 |
| Wen Bo Zhang | 1 |
- Beurs
- Insiders
- Jian Jun Chen
- Bedrijfsconnecties
