![Bao Zeng Wang](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Bao Zeng Wang
Directeur/Bestuurslid bij Henghui Technology Corp. Ltd.
Profiel
Bao Zeng Wang is currently a Member-Supervisory Board at HENGHUI Technology Corp.
Ltd.
His education history includes being a graduate from Southeast University.
Actieve functies van Bao Zeng Wang
Bedrijven | Functie | Begin |
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Henghui Technology Corp. Ltd.
![]() Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Directeur/Bestuurslid | 01-11-2020 |
Opleiding van Bao Zeng Wang
Southeast University | Graduate Degree |
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Bedrijven in privébezit | 1 |
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Henghui Technology Corp. Ltd.
![]() Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Producer Manufacturing |