Ren Rong Yu

HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China.

HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China.

HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China.

HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China.

HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China.

Beijing OmniVision Technologies Co., Ltd. engages in the design, research, development, marketing, and sales of complementary metal oxide semiconductor image sensors. The company focuses on the research of single-chip complementary metal oxide semiconductor camera solutions. It also develops imaging technology, related applications, and system integration; researches imaging, streaming media applications, and their enhancements; as well as researches and develops image and multimedia applications for mobile devices. The company was founded on July 15, 2015 and is headquartered in Beijing, China.

Beijing OmniVision Technologies Co., Ltd. engages in the design, research, development, marketing, and sales of complementary metal oxide semiconductor image sensors. The company focuses on the research of single-chip complementary metal oxide semiconductor camera solutions. It also develops imaging technology, related applications, and system integration; researches imaging, streaming media applications, and their enhancements; as well as researches and develops image and multimedia applications for mobile devices. The company was founded on July 15, 2015 and is headquartered in Beijing, China.

Beijing OmniVision Technologies Co., Ltd. engages in the design, research, development, marketing, and sales of complementary metal oxide semiconductor image sensors. The company focuses on the research of single-chip complementary metal oxide semiconductor camera solutions. It also develops imaging technology, related applications, and system integration; researches imaging, streaming media applications, and their enhancements; as well as researches and develops image and multimedia applications for mobile devices. The company was founded on July 15, 2015 and is headquartered in Beijing, China.

HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China.

HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China.

Beijing OmniVision Technologies Co., Ltd. engages in the design, research, development, marketing, and sales of complementary metal oxide semiconductor image sensors. The company focuses on the research of single-chip complementary metal oxide semiconductor camera solutions. It also develops imaging technology, related applications, and system integration; researches imaging, streaming media applications, and their enhancements; as well as researches and develops image and multimedia applications for mobile devices. The company was founded on July 15, 2015 and is headquartered in Beijing, China.

Beijing OmniVision Technologies Co., Ltd. engages in the design, research, development, marketing, and sales of complementary metal oxide semiconductor image sensors. The company focuses on the research of single-chip complementary metal oxide semiconductor camera solutions. It also develops imaging technology, related applications, and system integration; researches imaging, streaming media applications, and their enhancements; as well as researches and develops image and multimedia applications for mobile devices. The company was founded on July 15, 2015 and is headquartered in Beijing, China.

HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China.

HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China.

HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China.

HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China.

HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China.

Beijing OmniVision Technologies Co., Ltd. engages in the design, research, development, marketing, and sales of complementary metal oxide semiconductor image sensors. The company focuses on the research of single-chip complementary metal oxide semiconductor camera solutions. It also develops imaging technology, related applications, and system integration; researches imaging, streaming media applications, and their enhancements; as well as researches and develops image and multimedia applications for mobile devices. The company was founded on July 15, 2015 and is headquartered in Beijing, China.

Beijing OmniVision Technologies Co., Ltd. engages in the design, research, development, marketing, and sales of complementary metal oxide semiconductor image sensors. The company focuses on the research of single-chip complementary metal oxide semiconductor camera solutions. It also develops imaging technology, related applications, and system integration; researches imaging, streaming media applications, and their enhancements; as well as researches and develops image and multimedia applications for mobile devices. The company was founded on July 15, 2015 and is headquartered in Beijing, China.

Beijing OmniVision Technologies Co., Ltd. engages in the design, research, development, marketing, and sales of complementary metal oxide semiconductor image sensors. The company focuses on the research of single-chip complementary metal oxide semiconductor camera solutions. It also develops imaging technology, related applications, and system integration; researches imaging, streaming media applications, and their enhancements; as well as researches and develops image and multimedia applications for mobile devices. The company was founded on July 15, 2015 and is headquartered in Beijing, China.

Beijing OmniVision Technologies Co., Ltd. engages in the design, research, development, marketing, and sales of complementary metal oxide semiconductor image sensors. The company focuses on the research of single-chip complementary metal oxide semiconductor camera solutions. It also develops imaging technology, related applications, and system integration; researches imaging, streaming media applications, and their enhancements; as well as researches and develops image and multimedia applications for mobile devices. The company was founded on July 15, 2015 and is headquartered in Beijing, China.

HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China.

Beijing OmniVision Technologies Co., Ltd. engages in the design, research, development, marketing, and sales of complementary metal oxide semiconductor image sensors. The company focuses on the research of single-chip complementary metal oxide semiconductor camera solutions. It also develops imaging technology, related applications, and system integration; researches imaging, streaming media applications, and their enhancements; as well as researches and develops image and multimedia applications for mobile devices. The company was founded on July 15, 2015 and is headquartered in Beijing, China.